发明名称 HEAT-SENSITIVE TACKY ADHESIVE AGENT COMPOSITION AND HEAT- SENSITIVE TACKY ADHESIVE SHEET OR LABEL
摘要 PROBLEM TO BE SOLVED: To provide a heat-sensitive adhesive composition having delayed tackiness, free from tackiness at normal temperature to enable the use without using a releasing paper or a releasing treatment of the back of the substrate, having excellent antiblocking property at normal temperature and exhibiting excellent tacky adhesivity by heating and provide a heat-sensitive adhesive sheet or label. SOLUTION: The heat-sensitive adhesive composition is an aqueous emulsion composed of (A) a polymer having an acid value of 30-300 mgKOH/g and a glass transition temperature (Tg) of >=30 deg.C, (B) a compound having a melting point or softening point of 30-100 deg.C by differential scanning calorimetry and a solidifying point lower than the melting point or the softening point by >=10 deg.C and (C) a polymer having a glass transition temperature (Tg) of <=-20 deg.C. The weight ratios of the components A, B and C satisfy the formulas (1) and (2) (A)/(C)=15/85 to 50/50...(1), [(A)+(C)]/(B)=100/0.5 to 100/20...(2).
申请公布号 JP2002226823(A) 申请公布日期 2002.08.14
申请号 JP20010023321 申请日期 2001.01.31
申请人 MITSUBISHI CHEMICALS CORP;CHUO RIKA KOGYO CORP 发明人 OTA HIDEO;SEKO TOSHIYA
分类号 C09J7/02;C09J201/00;G09F3/10;(IPC1-7):C09J201/00 主分类号 C09J7/02
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