| 摘要 |
PURPOSE: A method for fabricating a leadframe for forming a semiconductor package is provided to simplify a structure and reduce fabricating cost, by improving the structure of the high-reliable leadframe. CONSTITUTION: Photoresist is applied on the upper and lower surfaces of the leadframe(1). An exposure and development process is performed regarding the photoresist applied on the upper and lower surfaces of the leadframe to form a predetermined pattern so that a full etching region(FER) and a half etching region(HER) are defined. The leadframe is etched to eliminate a die pad region while a half-etched inner lead having a half etching surface is formed.
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