| 摘要 |
PROBLEM TO BE SOLVED: To provide soldering flux capable of being stably and easily applied even when a backing electrode is small. SOLUTION: In the soldering flux, metallic particles consisting of metal having a melting point higher than hat of solder are added in flux consisting of resin. Silver is preferable as the metallic particles. The particles of 0.1-10μm, in particular, 0.1-5μm diameters are preferable. Thus, since print characteristics are remarkably improved, the soldering flux can be stably applied even when the backing electrode is small. |
