发明名称 |
FERROELECTRIC MEMORY DEVICE AND FORMING METHOD THEREOF |
摘要 |
<p>PURPOSE: A ferroelectric memory device and a method for forming the same are provided to prevent the electrical connection between a strip line and a plate line and to stably keep a contact resistance between the plate line and an upper electrode. CONSTITUTION: A first and a second interlayer dielectric(408,414) are formed on a semiconductor substrate(400). Lower electrodes(418) electrically connected with the semiconductor substrate(400), ferroelectrics(420) and upper electrodes(422) are sequentially formed to form ferroelectric capacitors(424). After forming a third interlayer dielectric(426) on the resultant structure, the planarization is performed to expose the upper electrodes(422) by etching the third interlayer dielectric(426). Then, a conductive layer is formed on the entire surface of the resultant structure. Then, plate lines(430) are formed to directly contact with the upper electrodes(422) by patterning the conductive layer.</p> |
申请公布号 |
KR20020064577(A) |
申请公布日期 |
2002.08.09 |
申请号 |
KR20010005147 |
申请日期 |
2001.02.02 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM, GI NAM;KIM, HYEON HO |
分类号 |
H01L27/105;H01L21/02;H01L21/768;H01L21/8246;H01L23/522;H01L27/115;(IPC1-7):H01L27/105 |
主分类号 |
H01L27/105 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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