发明名称 FERROELECTRIC MEMORY DEVICE AND FORMING METHOD THEREOF
摘要 <p>PURPOSE: A ferroelectric memory device and a method for forming the same are provided to prevent the electrical connection between a strip line and a plate line and to stably keep a contact resistance between the plate line and an upper electrode. CONSTITUTION: A first and a second interlayer dielectric(408,414) are formed on a semiconductor substrate(400). Lower electrodes(418) electrically connected with the semiconductor substrate(400), ferroelectrics(420) and upper electrodes(422) are sequentially formed to form ferroelectric capacitors(424). After forming a third interlayer dielectric(426) on the resultant structure, the planarization is performed to expose the upper electrodes(422) by etching the third interlayer dielectric(426). Then, a conductive layer is formed on the entire surface of the resultant structure. Then, plate lines(430) are formed to directly contact with the upper electrodes(422) by patterning the conductive layer.</p>
申请公布号 KR20020064577(A) 申请公布日期 2002.08.09
申请号 KR20010005147 申请日期 2001.02.02
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, GI NAM;KIM, HYEON HO
分类号 H01L27/105;H01L21/02;H01L21/768;H01L21/8246;H01L23/522;H01L27/115;(IPC1-7):H01L27/105 主分类号 H01L27/105
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