PURPOSE: A semiconductor package is provided to overcome a stack limit of semiconductor chips by forming electrode pads on both surface of the semiconductor chip. CONSTITUTION: A semiconductor package(100) comprises a semiconductor chip(10) mounted on a PCB(Printed Circuit Board)(20), a resin molding part(40) enclosed on the resultant structure for protecting the semiconductor chip(10) and the PCB(20) and solder balls(50) as an outer connection terminal formed on the rear surface of the PCB(20) for electrically connecting with the semiconductor chip(10). The semiconductor chip(10) further includes the first active surface(12) formed with first electrode pads(14) and the second active surface(16) formed with second electrode pads(18).
