| 摘要 |
PROBLEM TO BE SOLVED: To provide a power module, a composite substrate used therefor and a bonding solder therefor which has a little bond deformation, a high bond yield and a high bond zone reliability. SOLUTION: The power module has a ceramic board having a circuit board on one side and a radiation board on the other side, a heat sink board bonded to the radiation board through a metal bond A and a semiconductor power elements bonded to the circuit board through a metal bond B. Either of the metal bonds A, B is an Ag-Cu-Sn, Ag-Cu-In or Ag-Cu-Sn-In type Ag based alloy having a melting point of 500-600 deg.C and the other is solder, or either of the bonds A, B is an Ag based alloy containing Cu 10-30 wt.% and either Sn or in or both 20-40 wt.%. A composite board and a solder therefor are used for the module. |
