发明名称 ADHESIVE, COATING METHOD AND BONDED ASSEMBLY
摘要 PROBLEM TO BE SOLVED: To obtain an adhesive to be thinly and uniformly applied. SOLUTION: This adhesive is a liquid adhesive containing a thermosetting resin in which a hydrophilic group in an ionic state is bonded to the thermosetting resin, the ratio of the thermosetting resin to which the hydrophilic group is bonded is 5-30 wt.% and the hydrophilic group is a cation or an anion. This method for coating an adhesive comprises applying the liquid adhesive containing the thermosetting resin to which the hydrophilic group in an ionic state to one electroconductive adhesive surface formed on at least one of two materials to be mutually bonded and the adhesive is precipitated on the adhesive surface by an electrodeposition process through electrification.
申请公布号 JP2002220579(A) 申请公布日期 2002.08.09
申请号 JP20010016454 申请日期 2001.01.25
申请人 OKI DATA CORP 发明人 KISHIMOTO MITSURU;OISHI NOBORU;UEKI HIROYUKI;IKEDA KOIO
分类号 B41J2/16;C09J5/00;C09J201/02;C25D9/02;(IPC1-7):C09J201/02 主分类号 B41J2/16
代理机构 代理人
主权项
地址