| 摘要 |
PROBLEM TO BE SOLVED: To provide an inexpensive electroconductive paste superior in a filling property into a through-hole or non-through hole, and in electrical conductivity. SOLUTION: This is a resol-type phenolic resin, containing a binder and electroconductive powder, and the main components of the binder are the resol- type phenolic resin containing alkoxy group, a liquid epoxy resin and its curing agent. |
