| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface mount type light emitting device of higher reliability in which adhesion of a package molding to transparent resin buried in a recessed part can be more improved. SOLUTION: This package molding is provided with a recessed part 14 and a positive and a negative lead electrodes 21, 22. The electrodes are molded in an integral molding by using mold resin 10, in such a manner that the positive lead electrode and the negative lead electrode are exposed at a prescribed interval on a bottom surface of the recessed part. On the bottom surface of the recessed part, at least a pair of resin exposed parts 21a, 22a where mold resin is exposed laterally symmetrically are formed besides a part between the positive lead electrode and the negative lead electrode. |
