SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A semiconductor package is provided to form a layered structure stacked with same chips by using a lead frame. CONSTITUTION: A semiconductor package comprises a chip mount plate(10) having bent portions, a first adhesive part(20) deposited on the rear surface of the chip mount plate(10), a lower chip(16) fixed to the rear surface of the chip mount plate(10) by the first adhesive part(20), lower wires(24) connected between leads(12) of a lead frame and bonding pads of the lower chip(16), a second adhesive part(18) deposited on the front surface of the chip mount plate(10), an upper chip(14) fixed to the front surface of the chip mount plate(10) by the second adhesive part(18), upper wires(22) connected between the leads(12) of the lead frame and the bonding pads of the upper chip(14) and a resin(28) for enclosing the resultant structure except for the outer portions of the leads(12) of the lead frame.