发明名称 |
OPTICAL SEMICONDUCTOR MODULE |
摘要 |
PROBLEM TO BE SOLVED: To provide an optical semiconductor device module which reduces the deviation between a light emitting device and the center of a lens that is caused by a mismatch of the coefficient of linear expansion and whose optical output does not depend on temperature. SOLUTION: In bonding a mount with a substrate mounted with an optical semiconductor device to a lens holder that holds a lens and is be bonded to the mount, the position of a YAG laser welding for bonding the mount to the lens holder is shifted in the direction of the bottom surface of the mount from the height of the center of the lens to thereby prevent the deviation in an optical axis between the lens and the optical semiconductor device caused by a change in temperature.
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申请公布号 |
JP2002223025(A) |
申请公布日期 |
2002.08.09 |
申请号 |
JP20010355857 |
申请日期 |
2001.11.21 |
申请人 |
MITSUBISHI ELECTRIC CORP |
发明人 |
NAKANO SEISHI;TAKAGI SHINICHI |
分类号 |
G02B6/42;H01S5/022;(IPC1-7):H01S5/022 |
主分类号 |
G02B6/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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