| 摘要 |
Semiconductor packages and other electronic assemblies having an active heat sink are disclosed, along with methods of making the same. The active heat sink includes a cavity partially filled with a heat activated liquid. Heat generated during operation of a chip boils the heat activated liquid. The vapor condenses on an inner surface of the active heat sink and transfers heat to an outer, possibly finned, surface exposed to ambient to dissipate heat. In some embodiments, the active heat sink may be a closed vessel mounted on the chip. In some embodiments, the vessel of the active heat sink is formed from a die pad of a leadframe substrate. The die pad includes a recess that forms the active heat sink cavity when bonded to the back surface of the chip. The heat activated liquid directly contacts the back surface of the chip in these embodiments.
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