| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem that a void remains in a resin or a fault of an external appearance occurs in some cases when a space between leads is narrow, in an apparatus wherein a buffer sheet is brought into contact with one surface of a lead frame and held by upper and lower tools between and resin molding is conducted with parts of the leads made to project a little along the outer surface of an exterior resin. SOLUTION: In the apparatus for resin molding, the buffer sheet 13 is brought into contact with the non-mounting surface side of an electronic component main body 1 of the lead frame 2 and held by a pair of tools 9 and 14 between and the principal part on the lead frame 2 including the electronic component main body 1 is coated with the resin 8. The apparatus is equipped with a tool driving part 20 which controls clamping of the paired tools 9 and 14 in a stepped manner substantially and with a resin supply driving part 27 which increases gradually the injection pressure of the resin 8 in the initial clamping period and controls the injection pressure so that it be the maximum in the later clamping period.
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