| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a package for containing a semiconductor element in which the package can be bonded to an external electric circuit board with sufficient strength even if the package is reduced in size and wiring conductors are arranged with high density. SOLUTION: The package 4 for containing a semiconductor element comprises an insulating basic body 1 having a recess 1a for containing a semiconductor element 3 in the upper surface, wiring conductors 9 led out from the recess 1a to the outer surface and a plurality of metallize layers 7 for external connection having a different area formed on the lower surface, and a cover 2 wherein a plurality of recesses 7a are made in a metallized layer 7 for external connection having a large area. Even if the size of the package 4 for containing a semiconductor element is reduced, the area of the metallized layer 7 for external connection contributive to bonding to an external electric circuit board 8 is increased thus ensuring a sufficient bonding strength between the metallized layer 7 and the external electric circuit board 8.</p> |
