发明名称 DAMPING DEVICE AND METHOD OF COOLING THE DAMPING DEVICE
摘要 PROBLEM TO BE SOLVED: To efficiently cool the whole sensors provided in a damping device. SOLUTION: Cooling air is introduced through an air piping 18, ejected from opening parts of sensor heads 12b and 13b through air ejecting holes 16 and 17, and intercepted by a heat insulating plate 20 provided at the front face, thereby the cooling air is dispersed in all directions. Accordingly, air circulates around the surface of the sensor heated to the highest temperature and whole sensors are efficiently cooled.
申请公布号 JP2002212695(A) 申请公布日期 2002.07.31
申请号 JP20010007043 申请日期 2001.01.15
申请人 SHINKO ELECTRIC CO LTD 发明人 MURAKISHI KYOJI;KIMURA TETSUYUKI
分类号 C23C2/00;(IPC1-7):C23C2/00 主分类号 C23C2/00
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