| 发明名称 |
Catalytic reactive pad for metal cmp |
| 摘要 |
<p>A polishing pad including a polishing pad substrate and a catalyst having multiple oxidation states wherein the catalyst containing polishing pad is used in conjunction with an oxidizing agent to chemically mechanically polish metal features associated with integrated circuits and other electronic devices.</p> |
| 申请公布号 |
AU2002243592(A1) |
申请公布日期 |
2002.07.30 |
| 申请号 |
AU20020243592 |
申请日期 |
2002.01.18 |
| 申请人 |
CABOT MICROELECTRONICS CORPORATION |
发明人 |
CHRISTOPHER C. STREINZ;BRIAN L. MUELLER;STEVEN K. GRUMBINE |
| 分类号 |
B24B37/24;B24D3/34;B24D13/14;C09K3/14;H01L21/304;(IPC1-7):B24B37/04;H01L21/321;C09G1/02;C23F3/06 |
主分类号 |
B24B37/24 |
| 代理机构 |
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代理人 |
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| 主权项 |
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