| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treating method by which the supply time of a plurality of cleaners is shortened and a device can be miniaturized. SOLUTION: In a cleaning treatment, a wafer W is immersed in a mixed liquid generated by supplying pure water and chemicals A and B to a cleaning tank 60. The method has a process for supplying pure water and the chemicals A and B to the cleaning tank 60 until a liquid level in an inner tank 61 reaches a first level S1, a process stopping the supply of pure water where mix capacity is maximum after the liquid level reaches the first level S1 and supplying the chemicals A and B to mix capacity and a process for supplying pure water until the liquid level in an outer tank 62 reaches a second level S2 after the chemicals A and B are supplies by mix capacity.
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