发明名称 |
Stacked package structure of image sensor |
摘要 |
A stacked package structure of an image sensor for electrically connecting to a printed circuit board includes a substrate, an integrated circuit, an image sensing chip, and a transparent layer. The substrate has a first surface and a second surface opposite to the first surface. The first surface is formed with signal input terminals. The second surface is formed with signal output terminals for electrically connecting the substrate to the printed circuit board. The integrated circuit is mounted on the first surface of the substrate and electrically connected to the signal input terminals of the substrate. The image sensing chip is located above the integrated circuit to form a stacked structure with the integrated circuit for electrically connecting to the signal input terminals of the substrate. The transparent layer covers the image sensing chip. The image sensing chip receives image signals via the transparent layer and converts the image signals into electrical signals that are to be transmitted to the substrate. Thus, the image sensing chip of the image sensing product and the integrated circuit can be integrally packaged.
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申请公布号 |
US2002096729(A1) |
申请公布日期 |
2002.07.25 |
申请号 |
US20010770048 |
申请日期 |
2001.01.24 |
申请人 |
TU HSIU WEN;CHEN WEN CHUAN;HO MON NAN;CHEN LI HUAN;YEH NAI HUA;HUANG YEN CHENG;CHIU YUNG SHENG;LEE WEN TSAN;LIU JOE;LEE WU HSIANG;TSAI MENG RU |
发明人 |
TU HSIU WEN;CHEN WEN CHUAN;HO MON NAN;CHEN LI HUAN;YEH NAI HUA;HUANG YEN CHENG;CHIU YUNG SHENG;LEE WEN TSAN;LIU JOE;LEE WU HSIANG;TSAI MENG RU |
分类号 |
H01L31/0203;(IPC1-7):H01L21/00 |
主分类号 |
H01L31/0203 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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