| 摘要 |
An improved polishing pad, starting from a traditional sintered pad core or similar, is designed with a feature that controls the pore depth of the polishing pad. The pad interstitials are impregnated with a chosen material. This material is then liberated from the surface of the pad, by a variety of methods, leaving the remaining void space to form the desired surface texture for polishing. The invention allows for the bulk properties of the pad to remain more solid-like with a higher modules for improved planarization. At the same time a surface porosity depth is limited to both create an ideal surface texture and to allow for the polishing pad surface to remain clean and free of polishing by products and debris that tend to build-up with in the depths of a traditional sintered pad. This invention yields a polishing pad that is better suited for applications such as semiconductor wafer polishing, and the like.
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