发明名称 ELECTRONIC COMPONENT PROCESSING AND TAPE PACKAGING SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide electronic component processing and a tape packaging system wherein speed-up can be achieved as compared to a conventional system, avoiding sophistication of systems and additional maintenance costs. SOLUTION: In order that each of a first - fourth rotary tables 6-9 holds sets of electronic components each holding two components disposed at regular angular intervals on the outer periphery of the table, a plurality of sets each comprising two sucking nozzles 11, 12 which are radially spaced apart from each other are provided. Electronic components are supplied from the fourth rotary table 9 of the last stage to packaging tapes 3, 4. The tapes 3, 4 are disposed so as to be spaced apart in the circumferential direction of the table 9, while each of packaging roll 3 (4) extends along a straight line radially extending from the center of the table 9.
申请公布号 JP2002205706(A) 申请公布日期 2002.07.23
申请号 JP20000402644 申请日期 2000.12.28
申请人 UENO SEIKI KK 发明人 HARA YOSHIAKI
分类号 B65B15/04;H01L23/00;(IPC1-7):B65B15/04 主分类号 B65B15/04
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