SEMICONDUCTOR CHIP PACKAGE AND METHOD FOR FABRICATING THE SAME

摘要

PURPOSE: A semiconductor chip package and a method for fabricating the same are provided to bond a semiconductor chip with a semiconductor substrate by inserting a stud bump of the semiconductor chip into a contact hole of the semiconductor substrate. CONSTITUTION: A stud bump(34) is fused on a bond pad(32) of a semiconductor chip(30). An adhesive resin(46) is adhered to a surface of a substrate(40). A contact hole is formed in the substrate(40) including the adhesive resin(46). The stud bump(34) is inserted into the contact hole and the semiconductor chip(30) is adhered to the substrate(40). A solder ball(50) is fused on the substrate(40). The contact hole of the substrate(40) is electrically connected with a ball land(44). A conductive resin(42b) such as an anisotropic conductive film, an anisotropic conductive adhesive, and a conductive epoxy is applied to an inner face of the connection hole.