AXIAL LEAD TYPE SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To raise a bonding strength by suppressing occurrence of voids. SOLUTION: A rough part 6 is formed on the surface of a header 4 of a lead wire 3 facing a semiconductor chip 1. Forming of the rough path 6 allows air bubbles of a solder 2 which are easy to concentrate into a central part 3a of the header 4 to disperse toward a peripheral part 3b for escaping. Thus, occurrence of voids is suppressed. The increase of a contact area with the solder 2 due to formation of the rough part 6 raises a bonding strength.