发明名称 |
Method for fabricating stacked chip package |
摘要 |
A method for fabricating a stacked chip package comprises the steps of: (a) attaching a lower chip to a substrate or a lead frame; (b) electrically coupling the lower chip to the substrate or the lead frame; (c) providing a dummy chip with a film adhesive on a upper surface thereof; (d) attaching the dummy chip to the lower chip through an adhesive layer wherein a lower surface of the dummy chip is in contact with the adhesive layer; (e) attaching an upper chip to the dummy chip through the film adhesive; (f) electrically coupling the upper chip to the substrate or the lead frame; and (g) encapsulating the lower chip and the upper chip against a portion of the substrate or the lead frame with a molding compound. Since the dummy chip is bonded to the upper chip via a film adhesive, it is not necessary to monitor the thickness of the film adhesive after the upper chip is bonded to the dummy chip.
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申请公布号 |
US2002090753(A1) |
申请公布日期 |
2002.07.11 |
申请号 |
US20010754293 |
申请日期 |
2001.01.05 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING INC. |
发明人 |
PAI TSUNG-MING;PAO CHIH MIN;CHEN KUANG-HUI |
分类号 |
H01L25/065;(IPC1-7):H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
H01L25/065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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