发明名称 |
METHOD AND APPARATUS FOR REMOVING UNWANTED SUBSTANCE FROM SEMICONDUCTOR WAFER |
摘要 |
An apparatus for removing an unwanted substance from a semiconductor wafer, according to this invention, applies a peeling tape (T) to a protective tape (P) on the surface of the semiconductor wafer (W). An edge member (28) is placed in contact with the surface of the peeling tape (T) and run along the protective tape (P). The peeling tape (T) is peeled as being folded back by a large angle of 90 degrees or more at the tip of edge member (28). The protective tape (P) is peeled and removed along with the peeling tape (T) from the surface of the wafer. As a result, the unwanted substance is removed with high precision without breaking the wafer (W). |
申请公布号 |
WO0213236(A3) |
申请公布日期 |
2002.07.11 |
申请号 |
WO2001JP06556 |
申请日期 |
2001.07.30 |
申请人 |
NITTO DENKO CORPORATION;YAMAMOTO, MASAYUKI;AMETANI, MINORU |
发明人 |
YAMAMOTO, MASAYUKI;AMETANI, MINORU |
分类号 |
H01L21/683;H01L21/00;H01L21/304;H01L21/687 |
主分类号 |
H01L21/683 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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