| 发明名称 |
Electronic component and method of manufacture |
| 摘要 |
A method of manufacturing an electronic component includes providing a substrate (101), forming a semiconductor device in the substrate (101), depositing a metal layer (107) over the substrate (101) and electrically coupled to the semiconductor device, depositing a layer (108) of solder over the metal layer, and wire bonding a wire (109) to the metal layer (107). |
| 申请公布号 |
US6164523(A) |
申请公布日期 |
2000.12.26 |
| 申请号 |
US19980108448 |
申请日期 |
1998.07.01 |
| 申请人 |
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
发明人 |
FAUTY, JOSEPH K.;LETTERMAN, JR., JAMES P.;SEDDON, MICHAEL J. |
| 分类号 |
H01L21/60;B23K20/00;B23K20/16;H01L21/607;H01L23/485;(IPC1-7):B23K31/00;B23K31/02;H05K3/00 |
主分类号 |
H01L21/60 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
