发明名称 DIE FILLING METHOD FOR MATERIAL POWDER, POWDER FORMING DIE DEVICE, AND MATERIAL FEEDING BODY FOR POWDER FORMING DIE DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a die filling method for material powder, a powder forming die device, and material feeding body for the powder forming device capable of smoothly replacing the material powder and air in a pressed powder body forming hole, and making the density dispersion of the formed pressed powder body uniform. SOLUTION: The powder forming die device is constituted of a die plate 30 provided with the forming hole 20 pressed powder body having an opening 10 on its upper side, a material feeding body 40 provided slidably on the die plate 30 and movably toward the upper side of the opening 10, and holding inside a material powder M of the pressed powder body, and a moving mechanism 50 for moving the material feeding body 40 toward the opening 10, and on the lower face 40 of, a feeding port 60 for feeding the material powder M to the forming hole 20 pressed powder body. The material feeding body 40 is provided with an air discharge pipe 70 for discharging the air turned out from the forming hole 20 for the pressed powder body being displaced with the material powder M in the pressed powder body forming hole 20 to the outside of the material feeding body 40 on the tip position F in the moving direction toward the opening 10 of the feeding port 60.
申请公布号 JP2002192391(A) 申请公布日期 2002.07.10
申请号 JP20000398317 申请日期 2000.12.27
申请人 MITSUBISHI MATERIALS CORP 发明人 HASEGAWA MAKOTO;SASAKI MASAO
分类号 B30B11/00;B22F3/035;B30B15/30;(IPC1-7):B30B11/00 主分类号 B30B11/00
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