| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyimide web-like or endless pipe-like film, with a conductive metallized surface, which is highly adhesive even at high temperature. SOLUTION: A polyimide film (1) has a powder A of a fine fiber-like inorganic compound, with a coefficient of linear expansion equal to or below that of a polyimide resin, which is unevenly distributed and dispersed mostly in the surface part. In addition, the metallized polyimide film is constituted of a conductive thin metal film layer (2B) formed of a conductive metal B by a physical thin film forming means and a conductive thick metal film layer (3) formed by an electroplating process, coherently laminated, in that order, on the surface of the polyimide film. When the film is in the web shape, it can be used, for example, as an FPC substrate and when the film is in the shape of an endless pipe, it can be used, for example, as a heating belt for the electromagnetic induction process of a copying machine. |
