| 摘要 |
PROBLEM TO BE SOLVED: To provide a new-adhesive composition for semiconductor devices that includes no halogen as a flame retardant, satisfies the flame retardancy regulations which electric and electronic appliances are required with reduced emission of hazardous gas and smoke, and provide adhesive sheets and cover lay films for semiconductor devices including the same. SOLUTION: This adhesive composition for semiconductor devices is characteristically a thermosetting adhesive and includes the following chemicals (A) through (D) as essential components: (A) 100 pts.wt. of carboxyl group-bearing acrylonitrile-butadiene rubber, (B) 50-400 pts.wt. of epoxy resin, (C) a curing agent mixture including at least one kind of an aromatic polyamine with a reactivity factor Rg of 3-13 and an aromatic polyamine with a reactivity factor of 15-30 and (D) 0.1-5.0 pts.wt. of a hardening accelerator and additionally contains a polyfunctional phosphorus compound directly reactive with epoxy resin.
|
