| 摘要 |
PURPOSE: An epoxy tool of a die attach apparatus is provided to easily perform an attach of a semiconductor chip and to prevent a void by forming a pipe-type nozzle having a protruded hole line on a holder of an epoxy tool. CONSTITUTION: An epoxy tool includes a nozzle(6) formed with a hole line(HL) as one body without connecting parts, and the hole line(HL) having several shapes, such as an 'X'-type, an 'Y'-type or an asterisk-type respectively used when a mounted body is relatively small, the mounted body is relatively long, and the mounted body is relatively large. At this point, the one body nozzle is able to equally deposit an epoxy(4) on the larger surface, thereby preventing a void when attaching a semiconductor device, so that the attach is strongly performed.
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