| 摘要 |
A mold device includes two mold pieces having a mold cavity for receiving a material to be treated, a heating member for heating the mold pieces, and a cooling casing selectively movable to engage with the mold pieces and to cool the material received in the mold pieces after the material has been heated and formed by the heating member. The heating of the mold pieces by the heating member thus will not be affected by the cooling casing. The heating member is received in one of the mold pieces piece. The casing has a conduit for receiving the cooling media.
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