发明名称 Connecting method of resin material molded product, process cartridge and assembling method of process cartridge
摘要 A bonding method for bonding molded resin products, includes the step of bonding a first one of the molded resin products and a second one of the molded resin products by injecting resin material through a resin material injection path to a bonding portion therebetween, wherein the resin material injection path is formed in one of or both of the first resin material molded product and the second resin material molded product.
申请公布号 US6415121(B1) 申请公布日期 2002.07.02
申请号 US20000575443 申请日期 2000.05.22
申请人 CANON KABUSHIKI KAISHA 发明人 SUZUKI AKIRA;ABE KENSHIRO;TSUDA TADAYUKI;SASAKI SHINICHI;MIYABE SHIGEO;HIRATSUKA KOUICHI
分类号 G03G21/18;B29C45/00;B29C45/14;B29C45/16;B29C65/00;B29C65/42;B29C65/70;B29K23/00;B29L31/00;(IPC1-7):G03G15/00 主分类号 G03G21/18
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