发明名称 |
Connecting method of resin material molded product, process cartridge and assembling method of process cartridge |
摘要 |
A bonding method for bonding molded resin products, includes the step of bonding a first one of the molded resin products and a second one of the molded resin products by injecting resin material through a resin material injection path to a bonding portion therebetween, wherein the resin material injection path is formed in one of or both of the first resin material molded product and the second resin material molded product.
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申请公布号 |
US6415121(B1) |
申请公布日期 |
2002.07.02 |
申请号 |
US20000575443 |
申请日期 |
2000.05.22 |
申请人 |
CANON KABUSHIKI KAISHA |
发明人 |
SUZUKI AKIRA;ABE KENSHIRO;TSUDA TADAYUKI;SASAKI SHINICHI;MIYABE SHIGEO;HIRATSUKA KOUICHI |
分类号 |
G03G21/18;B29C45/00;B29C45/14;B29C45/16;B29C65/00;B29C65/42;B29C65/70;B29K23/00;B29L31/00;(IPC1-7):G03G15/00 |
主分类号 |
G03G21/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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