A DISPERSION-BASED HEAT SEALABLE COATING

摘要

Film-forming reactive systems for the surface-to-surface bonding and/or coating of substrates, more particularly for heat-sealable coatings are provided. The system is based on an aqueous dispersion of at least two epoxy-curab le resins (1) and an epoxy compound as the curing component (II). The epoxy- curable resins are a polyurethane polymer containing epoxy-reactive function al groups present as the curable resin (1a) and an aqueous dispersion of an acrylate and/or methacrylate homopolymer or copolymer containing carboxyl and/or methylol groups present as an additional curable resin (1b). Also provided i s a method for the production of laminates which employs the reactive system to bond substrates.