发明名称 PACKAGE FOR CONTAINING SEMICONDUCTOR ELEMENT
摘要 PROBLEM TO BE SOLVED: To reduce reflection loss in a transmission, line even if the frequency of a high frequency signal inputted to a semiconductor element or outputted therefrom increases. SOLUTION: The package for containing a semiconductor element comprises a basic body 1 having a mounting part 1a for mounting an optical semiconductor element 7 and a circuit board 9 on the upper surface thereof through amounting base 8, a metal frame 2 fixed to the upper surface while surrounding the monitoring part 1a and having a through-hole 2a in the side part, and a coaxial connector 3 comprising a tubular outer circumferential conductor 3a, a central conductor 3c disposed substantially in the center thereof and an insulator 3b interposed between them, such that the opposite ends of the central conductor 3c project. Forward end of the coaxial connector 3 on the inside of the frame 2 of the central conductor 3c is substantially flush with the inner surface of the frame 2, the central conductor 3c is connected electrically with the circuit board 9 via a planar metal piece 10 and the through-hole 2a is enlarged from the end of the metal piece 10 toward the inner surface of the frame 2.
申请公布号 JP2002185068(A) 申请公布日期 2002.06.28
申请号 JP20000376031 申请日期 2000.12.11
申请人 KYOCERA CORP 发明人 SAWA YOSHINOBU;SAKUMOTO DAISUKE
分类号 H01L23/02;H01L31/0232;H01S5/022;(IPC1-7):H01S5/022;H01L31/023 主分类号 H01L23/02
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