发明名称 MOUNTING STRUCTURE FOR WIRING BOARD AND SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a mounting structure for wiring board which can solve the problem raised by the conventional structure that high-frequency electric signals are hot able to be transmitted favorably through the connection between a wiring board and an external electric circuit board and reliable continuity is not secured in the connection, because the reflection and radiation losses of the high-frequency electric signals become larger in the connection. SOLUTION: In this mounting structure for wiring board, a connection pad 4 has a solder leading-out section 7 which is protruded toward the center of an insulating substrate, and a continuity pad 5 has a solder leading-out section 8 which is protruded in the direction opposite to the protruded direction of the solder leading-out section 7 of the pad 4 faced to the pad 5. When the wiring board 1 is mounted on the external electric circuit board 6, meniscus tails are formed of solder 3 flowing out to the solder leading-out sections 7 and 8. Consequently, the reflection and radiation losses of the high-frequency electric signals can be reduced and, at the same time, the continuity between the boards 1 and 6 can be secured surely, because the shape of the connection between the boards 1 and 6 becomes an inclined structure. Therefore, high connection reliability can be obtained.
申请公布号 JP2002185112(A) 申请公布日期 2002.06.28
申请号 JP20000378934 申请日期 2000.12.13
申请人 KYOCERA CORP 发明人 SATO SHINGO;BASHO YOSHIHIRO
分类号 H05K3/34;H01L21/60;H05K1/18;(IPC1-7):H05K3/34 主分类号 H05K3/34
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