METHOD AND DEVICE FOR ATTACHING SOLID-STATE IMAGE PICKUP CHIP TO PACKAGE

摘要

PROBLEM TO BE SOLVED: To prevent an adhesive used for fixing a CCD image pickup chip to a package from penetrating into the light receiving part of the CCD image pickup chip. SOLUTION: An adhesive 18 cured by ultraviolet radiation is cast between a CCD image pickup chip 1 and a package 6, ultraviolet radiation 10 is applied to the excessive adhesive 18A flowing into the light receiving part of the CCD image pickup chip, and the surface of the adhesive 18A is cured to lose the fluidity.