| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of evaluating flatness of electrode pad provided on mounting surface of mounting substrate which can solve the problem raised by the conventional method that such surface flatness of electrode pads that reflects the actual mounting process is difficult to be obtained and, accordingly, the flatness is evaluated far from the actual data. SOLUTION: The flatness of the electrode pads 4 of a mounting substrate 3 having a plurality of electrode pads 4 on its semiconductor device 1 mounting surface is evaluated in such a way that, a first virtual plane is obtained from (n) sets of three-dimensional coordinate data obtained by measuring measuring points set on (n) (an integer of >=4) pieces of electrode pads 4 by using the method of least squares, and a second virtual plane is obtained from (n-1) sets of three-dimensional coordinate data obtained by measuring the measuring points excluding the point having the lowest height from the first virtual plane by using the method of least squares. After the (n-2)-th virtual plane is obtained by successively repeating the above-mentioned operation until three sets of three-dimensional coordinate data are obtained, the distances of the (n) points from the (n-2)-th virtual surface are found as evaluated heights.
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