CHIP-TYPE ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To realize a method of manufacturing chip-type electronic components having superior electrical characteristics at a low cost by using the terminal electrode structure of various chip-type electronic components in common, and to provide various chip-type electrode components equipped with terminal electrodes having high adhesive force and high solder wettability. SOLUTION: Conductive metal powder and curing resin are kneaded together into a conductive resin paste, the conductive resin paste is applied for the formation of a base electrode layer 3 of thickness 10μm or larger, and a terminal electrode is composed of the base electrode layer 3 and a solder layer 6, which is 3μm or larger in thickness and formed on the prime electrode layer 3 through a complex reaction occurring between organic acid lead and metallic tin.