发明名称 POLYAMIDE RESIN COMPOSITION
摘要 A polyamide resin composition which is excellent in heat resistance and strength/rigidity and especially has a high surface impact strength at low temperatures. The polyamide resin composition is characterized by comprising a polyamide resin and a swellable fluoromica represented by the following structural formula and having a cation-exchange capacity of 80 meq/100 g or smaller, and by having a surface impact strength at -30 DEG C of 10 J or higher: Naa(MgxLiss)Si4OyFz wherein 0 < alpha </= 0.50, 0 < beta </= 0.50, 2.5 </= x </= 3, 10 </= y </= 11, and 1.0 </= z </= 2.0, provided that 90/10 </= alpha / beta </= 10/90.
申请公布号 WO0250187(A1) 申请公布日期 2002.06.27
申请号 WO2001JP11115 申请日期 2001.12.19
申请人 UNITIKA LTD.;OGAMI, AKINOBU;FUJIMOTO, KOJI;WAKAMURA, KAZUYUKI;YAMAGUCHI, AKIRA;ITO, RIE 发明人 OGAMI, AKINOBU;FUJIMOTO, KOJI;WAKAMURA, KAZUYUKI;YAMAGUCHI, AKIRA;ITO, RIE
分类号 C08K3/34;C08K9/02;(IPC1-7):C08L77/00;C08K3/16 主分类号 C08K3/34
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