发明名称 METHOD OF CREATING PHOTONIC VIA
摘要 A photonic via is made in a substrate (222) by making a hole in the substrate, heating the substrate, and inserting an optical fiber (220) into the hole. In one embodiment, a lens can (250) be made by applying a polymer on top of the photonic via and curing.
申请公布号 WO0250593(A1) 申请公布日期 2002.06.27
申请号 WO2001US44789 申请日期 2001.11.15
申请人 INTEL CORPORATION;MURALI, VENKATESAN 发明人 MURALI, VENKATESAN
分类号 G02B6/26;C03C15/00;G02B6/122;G02B6/42;G02B6/43;(IPC1-7):G02B6/43 主分类号 G02B6/26
代理机构 代理人
主权项
地址