| 摘要 |
<p>An integrated circuit chip includes a cascode amplifier having a first NMOS transistor with the gate receiving an input signal a source connected to ground through an inductance and a drain connected to the source of a second NMOS transistor. The drain of the second transistor is connected to a supply voltage through another inductance. The gate of the second transistor is connected to a DC bias voltage through a resistor and is connected to a first plate of an on-chip parallel plate capacitor. The other plate of the capacitor is connected to a wirebond pad for connection to a circuit board through a bond wire. The capacitor together with the inductance of the bond wire form a short circuit at the operating voltage of the amplifier.</p> |
