发明名称 |
Retention module for securing heat sink |
摘要 |
A retention module for securing a heat sink (4) to a board-mounted socket connector (2) comprises a pair of metal frames (5) and four screws (54) for securing the frames to the PCB. Each frame includes a bottom wall (50), a pair of first side walls (51) and a second side wall (52) together defining a receiving space (53) for receiving a side portion of the heat sink. The bottom wall includes an integrally formed grounding plate (50c) to contact the heat sink. The retention module further comprises a pair of clips (6) assembled to the frames thereby increasing the securing relationship between the heat sink and the frames.
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申请公布号 |
US2002081882(A1) |
申请公布日期 |
2002.06.27 |
申请号 |
US20010033312 |
申请日期 |
2001.12.26 |
申请人 |
LAI MING-CHUN;YU HUNG-CHI |
发明人 |
LAI MING-CHUN;YU HUNG-CHI |
分类号 |
H01L23/40;H05K7/10;(IPC1-7):H01R13/15;H01R13/62 |
主分类号 |
H01L23/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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