发明名称 Retention module for securing heat sink
摘要 A retention module for securing a heat sink (4) to a board-mounted socket connector (2) comprises a pair of metal frames (5) and four screws (54) for securing the frames to the PCB. Each frame includes a bottom wall (50), a pair of first side walls (51) and a second side wall (52) together defining a receiving space (53) for receiving a side portion of the heat sink. The bottom wall includes an integrally formed grounding plate (50c) to contact the heat sink. The retention module further comprises a pair of clips (6) assembled to the frames thereby increasing the securing relationship between the heat sink and the frames.
申请公布号 US2002081882(A1) 申请公布日期 2002.06.27
申请号 US20010033312 申请日期 2001.12.26
申请人 LAI MING-CHUN;YU HUNG-CHI 发明人 LAI MING-CHUN;YU HUNG-CHI
分类号 H01L23/40;H05K7/10;(IPC1-7):H01R13/15;H01R13/62 主分类号 H01L23/40
代理机构 代理人
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