An electronic circuit device capable of preventing heat and pressure of resin from being applied to mounted electronic components when a circuit board with the electronic components mounted thereon is encapsulated with the resin. A circuit board (10) with electronic components (11) and ICs (12) mounted thereon is accommodated in a sleeve formed of a heat-shrinkable film (16), the heat-shrinkable film (16) is shrunk by heat and intermediately packaged. The whole package including the circuit substrate (10) is encapsulated with the resin (17).
申请公布号
WO0250900(A1)
申请公布日期
2002.06.27
申请号
WO2001JP11089
申请日期
2001.12.18
申请人
SONY CORPORATION;ITO, YOSHINORI;OSHIMO, KUNIO;IMAI, MIKITO;OZAKI, HIROSHI