| 摘要 |
The present invention aims to provide a method of manufacturing a semiconductor device, which is capable of reducing or preventing damage of wirings formed over a semiconductor substrate. A method of manufacturing a semiconductor device comprises a step for forming a wiring on the surface of a semiconductor substrate with a predetermined circuit formed thereon, a step for forming a resin layer whose surface is substantially flat, on the wiring, and a step for processing the back of the semiconductor substrate after the formation of the resin layer.
|
