发明名称 ONE-PACK MOISTURE-CURING EPOXY RESIN COMPOSITION
摘要 A one-pack moisture-curing epoxy resin composition which can be cured at ordinary temperatures and is improved in storage stability without impairing the quickness of curing, i.e., is excellent in two properties incompatible with each other. This composition comprises one ore more members selected from the group consisting of vinyl carboxylates of the general formula (1) and epoxy-containing silyl compounds of the general formula (2), one or more members selected from the group consisting of ketimines and oxazolidines, and an epoxy resin. (1) [In the general formula (1), R1, R2, R3, and R4 are each independently hydrogen or an organic group; and n is an integer of 1 or above] (2) [In the general formula (2), R5 and R6 are each independently alkyl; R7 is an epoxy-containing organic group; and n is an integer of 1 to 3]
申请公布号 WO0250155(A1) 申请公布日期 2002.06.27
申请号 WO2001JP11072 申请日期 2001.12.17
申请人 发明人 ENDO, TAKESHI;SANDA, FUMIO;HORII, HISAKAZU;SUZUKI, KENTARO;MATSUURA, NOBUTERU
分类号 C07F9/38;C08G59/40;(IPC1-7):C08G59/40;C08G59/50;C08L63/00 主分类号 C07F9/38
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