| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device for realizing a small thin package suitable for mounting a small semiconductor chip by making a supporting board thin. SOLUTION: Two sheet of conductive foils 82 and 83, and a thermoplastic resin film 81 between them are subjected to thermo compression bonding in a body to form a supporting board 80. During the thermo compression bonding, a conductive material 87 for connecting both conductive foils 82 and 83 is so formed that the conductive material 87 is passed through the thermoplastic resin film 81 without using a via hole. Each electrode is formed from the conductive foil 82 and a semiconductor chip 88 is mounted. In the final step, each connection electrode is formed from the conductive foil 83, so the semiconductor chip 88 during the bonding can be prevented from the vertical shift. In this way, a greatly thin mounting structure can be realized by using a simple structure, and a semiconductor device optimum for mounting the small semiconductor chip can be realized. |
