发明名称 |
APPARATUS AND METHOD FOR TREATING SUBSTRATE AS WELL AS METHOD FOR MANUFACTURING DEVICE PRODUCT |
摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus for treating a substrate capable of properly treating the substrate by improving a liquid drip after supply of a treating liquid is completed. SOLUTION: A through hole 259 for passing a treating liquid supply nozzle 370 is formed at a center of a shielding plate 250 for shielding an upper surface of the substrate. The nozzle 370 has a double cylindrical structure in which a treating liquid tube 378 is internally engaged with a holding tube member 371. A distal end of the nozzle 370 is formed in a taper shape and formed in a sharp shape having no substantially horizontal surface. A discharge port 387a is formed at the distal end. A gas passage 381 for guiding a nitrogen gas to the substrate is formed at the outside of the nozzle 370. A peripheral edge 20 of the opening of the hole 250 is chamfered.
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申请公布号 |
JP2002176020(A) |
申请公布日期 |
2002.06.21 |
申请号 |
JP20010259844 |
申请日期 |
2001.08.29 |
申请人 |
SONY CORP;DAINIPPON SCREEN MFG CO LTD |
发明人 |
IWAMOTO ISATO;NISHIZAKI MITSUHIRO;AISAKA TSUTOMU;ABE HITOSHI;AMINO TOSHIHIKO;UCHIDA SHIN |
分类号 |
G02F1/13;B08B3/02;G02F1/1333;H01J9/38;H01L21/304;H01L21/306;(IPC1-7):H01L21/304;G02F1/133 |
主分类号 |
G02F1/13 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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