PRETREATMENT METHOD FOR ELECTROFORMING

摘要

PROBLEM TO BE SOLVED: To provide a pretreatment method for electroforming capable of cleanly removing the plating liquid stuck to the surface of a master mold, further homogenizing the surface of the mold, peeling the stamper mold or mother mold so as not to give rise to flaws on the mother mold or stamper mold formed by electroforming and further preventing the occurrence of the cause for a smear on the surface of the mold. SOLUTION: This method includes an acid activation step, a drying step and a peeling film forming step to bed carried out after the former steps.