| 摘要 |
A package for an integrated circuit device having an optical cell is disclosed. A method of making the package also is disclosed. The package includes a base of molded encapsulant material. A metal leadframe is embedded in the plastic base at the upper surface of the base. Encapsulant material covers the lower and side surfaces of the die pad and the leads of the leadframe, but does not cover the upper surfaces of the die pad and leads. The side surfaces of the die pad and leads have locking features for engaging the encapsulant material. An optical integrated circuit device is attached to the exposed surface of the die pad. An adhesive bead is applied around the optical device on the exposed upper surface of the leads. An optically clear cover is placed on and, in some embodiments, pressed into the still-viscous adhesive bead. When hardened, the bead supports the cover above the optical device. The side surfaces of the optically clear cover, or the surface of the cover facing the optical device, are provided with locking features that engage the adhesive bead and strengthen the connection between the cover and the adhesive bead. |
