| 摘要 |
The present invention comprises various embodiments of an apparatus and method for electrically testing an integrated circuit wafer interposer assembly. In certain embodiments, the wafer interposer assembly is fixed into a positioning device and moved over a test head to precisely align the contact pads for one device with the contacts of the test head. In certain embodiments, the positioning device facilitates temperature controlled testing of the wafer. In certain embodiments, multiple devices can be tested simultaneously in parallel.
|
