发明名称 Stack-type expansible electronic device
摘要 A stack-type expansible electronic device includes a primary circuit board unit and at least one auxiliary circuit board unit. The primary circuit board unit includes a primary substrate having first and second major surfaces, which are respectively formed with substrate terminals and board terminals that extend transversely therefrom. One of the first and second major surfaces is further formed with a signal distribution circuit that is connected electrically to the substrate and board terminals. The auxiliary circuit board unit includes an auxiliary substrate having third and fourth major surfaces, and a set of conductive vias that extend from the third major surface through the fourth major surface and that permit the substrate terminals to extend respectively therethrough such that the auxiliary substrate is spaced apart from the primary substrate and such that the conductive vias are connected electrically to the signal distribution circuit via the substrate terminals. At least one of the third and fourth major surfaces has at least one expansion circuit component mounted thereon, and is formed with circuit traces for interconnecting electrically the conductive vias and the expansion circuit component.
申请公布号 US2002075662(A1) 申请公布日期 2002.06.20
申请号 US20010779172 申请日期 2001.02.08
申请人 ABOCOM SYSTEMS, INC. 发明人 OH-YANG ERIC
分类号 H01L25/10;H05K1/14;(IPC1-7):H05K1/14 主分类号 H01L25/10
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